MediaTek Announces Dimensity 8000 and 8100 Chipsets for Premium 5G Smartphones

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MediaTek Announces Dimensity 8000 Series SoC for Premium 5G Smartphones

After the launch of the Dimensity 9000 chipset at the end of last year, key specifications for MediaTek’s next-generation 8000 series 5G chips were leaked earlier this year. And now, MediaTek has officially announced the Dimensity 8000 chip series, which includes the Dimensity 8000 and Dimensity 81005G chipsets. These new MediaTek chipsets will power several 5G flagship smartphones in the future. So let’s see what they have to offer.

The latest Dimensity 8000 5G series Features TSMC’s 5nm architecture and octa-core design.. MediaTek states that it has packed all the advanced technology from the previous Dimensity 9000 chip into the Dimensity 8000 and Dimensity 81005G chipsets.In fact, the company has a low-end Dimensity 8000 chip. “younger brother” Flagship Dimensity 9000 chipset

“The MediaTek Dimensity 8000 Series is the younger brother of our flagship Dimensity 9000 chip, which brings flagship-grade features and the next level of energy efficiency to the premium smartphone market.” CH Chen, Deputy General Manager of MediaTek Wireless Communications Business Unit, said.

Chipset features for both Dimensity 8000 and Dimensity 8100 ARM Mali-G610 GPU and MediaTek’s HyperEngine 5.0 Gaming Technology.. In terms of core performance, the low-end Dimensity 8000 SoC has four ARM Cortex-A78 cores clocked up to 2.75GHz, and the Dimensity 8100 chipset has four premium ARM Cortex-A78 cores with speeds up to 2.85GHz. Both chips have a 4x Cortex-A55 core that is clocked up to 2.0 GHz.

There is also quad channel support LPDDR5 memory When UFS3.1 storageMediaTek 5th Generation APU 580, Wi-Fi 6E, and Bluetooth version 5.3.

Besides these, the new Dimensity 8000 series chipsets support up to 200MP camera and 4K / 60 HDR10 + video recording.. Equipped with a 5 gigapixel / sec image signal processor (ISP), it produces clearer HDR images and videos much faster.

In addition, the new chipset features MediaTek’s latest noise reduction and AI-based deblurring technology to provide clearer, lower-light images. It also supports dual HDR video recording, allowing users to capture high quality video at the same time with the front and rear cameras.In addition, it works MediaTek’s 5G UltraSave 2.0 technology Improve power efficiency while using 5G networks.

Upcoming Dimensity 8000 and 81005G Phones

Currently, several OEMs such as OnePlus, Realme, Xiaomi and Oppo have confirmed that smartphones with the latest MediaTek chipsets will release smartphones with Dimensity 8000 and 8100. Realme recently went to Weibo (screenshot below) to see that the next Realme GT Neo 3 will be powered by the latest Dimensity 8100 chipset. It also supports the company’s latest 150W UltraDart charging technology.

realme confirms MediaTek Dimensity 8100 for GT Neo 3

Besides this, OnePlus’ upcoming device (probably Nord 3) will bring Oppo’s latest 150W SuperVOOC fast charging technology to market and will be equipped with the Dimensity 8100 chipset. Oppo, meanwhile, has confirmed that the K10 series will be the first to feature the Dimensity 8000 chipset.

I also added MediaTek New Dimensity 1300 Chips to 5G chip lines with octa-core design. It has an ultracore Cortex-A78 clocked up to 3GHz, three Cortex-A78 supercores, and four Cortex-A55 efficiency cores. The chipset also comes with an ARM Mali-G77 GPU integrated for AI-based features and MediaTek’s APU 3.0. In addition, it supports cameras up to 200MP, HyperEngine 5.0 tech and more. The OnePlus Nord phone, which is expected to be released soon, is expected to be equipped with it.

Therefore, from the first quarter of 2022, there are many flagship smartphones installed in the Dimensity 8000 series chipset. Stay tuned for more details. In the meantime, let us know what you think about the latest Diemnsity chipsets in the comments.